Sunday, July 8, 2012

TPA6110A2, Optimized Depop Circuitry for Stereo Headphone Audio Power Amplifiers

The TPA6110A2is an ideal optionfor stereo headphone applicationsin portable equipment, such as MP3 players,  wireless phones, Internet appliances, voice recorders and CD players. It consists of the TI TPA6110A2 150-mW stereo audio power amplifier IC in a very small MSOP package, along with a small number of other parts mounted on a circuit board that is approximately one and a quarter inches square!TPA6110A2 MSOP EVM Schematic Diagram
According tothe TPA6110A2 datasheet, total harmonic distortion plus noise (THD N) for 32-Ohm loads is reduced to less than 0.02 percent at 1 kHz and is less than 1 percent across the audio band of 20 Hz to 20 kHz. It includes a list of EVM features, a brief description of the module illustrated with a pictorial diagram, and a list of EVM specifications.

You can find an interesting section about quick start list when using plug-n-playaudio amplifierevaluation platform with the TPA6110A2 MSOP EVM within the datasheet. Another feature of this device is that it can eliminate "pops" and "click" which is known as a depop circuitry. Also, it is compatible to the TPA1x2 family.

Source: http://www.hqew.net/circuit-diagram/TPA6110A2$2c-Optimized-Depop-Circuitry-for-Stereo-Headphone-Audio-Power-Amplifiers_5288.html

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