Electronic Components Prices in 2011—Rise or Not?

Because of the increasing costs of labor and raw materials, it is expected that some electronic components will rise in their prices in some degrees. Based on the market survey, inductors and electrolytic capacitors belong to these electronic components as well.
Actually, manufacturers do not insist that the prices of all electronic components will go up in 2011, for example, OVP parts. Lots of manufacturers believe that the price of OVP parts will be stable and will not rise obviously in this year. By contrast, as for aluminum electrolytic capacitors market, some experts of IC components industry, for example, Liu Quanwang, aluminum electrolytic capacitors product marketing director of TDK-EPC group member, Greater China EPCOS, suggest that the price of aluminum electrolytic capacitors would develop in the rising trend. The reason for this phenomenon of electronic components market is the rising cost of some raw materials and energy costs. Moreover, it needs to point out that the raw materials above refer to aluminum and papers and so on; while, energy costs consist of the main production costs of anodic aluminum foil.
At the same time, the costs of labor in China rise rapidly as well and some specialists predict the increasing trend of the cost of Chinese labor will continue in the coming years. What’s more, tantalum electrolytic capacitors’ situation is similar to aluminum electrolytic capacitors’ which has been introduced above. According to the above analysis, some but not all electronic components will rise in their prices in 2011.

The Warnings for Solder Electronic Components

Here are some warnings for solder  electronic components:
1. When making electrical joints, always use electrical (rosin core) solder. Plumbing (acid core) solder is corrosive and will oxidize electrical joints, which will cause the electrical circuit to fail.
2. Do not use too much solder, since excess solder may run into other electrical joints and cause a short-circuit.
3. Do not expose electronic components to excess heat for long periods of time. Many electrical and electronic components are prone to premature failure with prolonged exposure to excess heat.

How do you like rf5322?

RF5322 is a linear, medium-power, high-efficiency, two-stage amplifier IC designed specifically for battery-powered WLAN applications such as PC cards, mini PCI, and compact flash applications. The device is manufactured on an advanced InGaP Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as the final RF amplifier in 2.5GHz OFDM and other spreadspectrum transmitters. The device is provided in a 2.2mmx2.2mm, 8-pin, QFN with a backside ground. The RF5322 is designed to maintain linearity over a wide range of supply voltages and power outputs. The RF5322 also has built-in power detector and incorporates the input, interstage, and output matching components internally which reduces the component count used externally and makes it easier to incorporate on any design.
And rf5322 is one of  non-ic electronic components, how do you like its features?
The Features:

• Single Power Supply 3.0V to 3.6V
• 24dB Minimum Gain
• Input and Output Matched to 50Ω
• 2400MHz to 2500MHz Frequency Range
• +18dBm @ <2.5% typ EVM, 120mA @ 3.3V_CC